Inspection: Manual & Automated

  • 200mm compatible
  • 2um rejects or greater = macro defects
  • Ideal for dedicated masks of a single die type
  • AOI is recommended on high die count wafers requiring 100% inspection
certificate
  • Compatible with incoming test maps
  • Chipping from singulation process
  • Maps can be exported to die sort tools
  • Types of defects: bond pad corrosion, discoloration, embedded material, bridging, and
manual * Customer-Defined Rejection Criteria can be
Applied, Filtering for Defects as small as 2um.

FAST TURN DIE PREP SERVICE WITHOUT
COMPROMISING QUALITY