Inspection: Manual & Automated
- 200mm compatible
- 2um rejects or greater = macro defects
- Ideal for dedicated masks of a single die type
- AOI is recommended on high die count wafers requiring 100% inspection
- Compatible with incoming test maps
- Chipping from singulation process
- Maps can be exported to die sort tools
- Types of defects: bond pad corrosion, discoloration, embedded material, bridging, and
* Customer-Defind Rejection Criteria can be
Applied, Filtering for Defects as small as 2um.