Pick & Place

manual
  • Up to 300mm compatible
  • 200um to 25mm devices
  • Pick to Gel Paks, Tape & frame, and waffle packs
  • Multi-Project wafers
  • Backside Inspection capabilities for chipping
manual
  • Die flip capabilities
  • Pick from wafer map with multiple binning
  • Full trace requirements (Manual)
  • Tight placement accuracies
  • (5) Fully Automatic Pick Tools inluding Datacon EVO 2200 system

FAST TURN DIE PREP SERVICE WITHOUT
COMPROMISING QUALITY