Pick & Place
- Up to 300mm compatible
- 200um to 25mm devices
- Pick to Gel Paks, Tape & frame, and waffle packs
- Multi-Project wafers
- Backside Inspection capabilities for chipping
- Die flip capabilities
- Pick from wafer map with multiple binning
- Full trace requirements (Manual)
- Tight placement accuracies
- (5) Fully Automatic Pick Tools inluding Datacon EVO 2200 system
